Failure Analysis Engineer (GL6 Test)

Foxconn Industrial Internet
Mount Pleasant, WI
Category Research
Job Description
FII USA, Inc. is seeking a Failure Analysis Engineer to support failure analysis investigations on PCB/PCBA issues and support Hardware design and Operations engineering activities. The role involves interpreting failure symptoms, identifying failure modes, and driving process improvements. The engineer will work within Operations, R&D Labs, and production support environments and will have opportunities to expand their career in Smart Manufacturing.

Requirements

  • Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related technical field.
  • 3-5 years of experience in electronics failure analysis, debugging, or product design.
  • Demonstrated ability to debug complex hardware issues using logic analyzers, oscilloscopes, multimeters, and related test equipment.
  • Strong understanding of server and storage technologies, including Intel and AMD x86/ARM multicore processors, DDR2–DDR5 and NAND memory, and PCA design.
  • Working knowledge of high-speed interfaces and protocols such as PCIe, SAS, SATA, NVMe, SCSI, Ethernet, Fibre Channel, Wi-Fi, and Bluetooth.

Benefits

  • Comprehensive benefits package including medical, dental, and vision insurance coverage.
  • Basic life insurance and short-term disability coverage provided by employer.
  • Supplemental life insurance and long-term disability coverage options available.
  • 401K with employer contribution.
  • Personal, Vacation, and Holiday paid time off for all full-time employees.
  • Onsite Aurora Health & Wellness Center available for all employees.
  • Employees are continuously encouraged to learn and grow their careers in smart manufacturing.
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