Role OverviewA Failure Analysis Technician will work at TSMC Arizona's semiconductor fab, performing precise failure analysis on leading-edge semiconductor devices. This role involves operating advanced analytical tools, preparing samples, handling chemicals safely, and meticulously documenting findings to ensure product quality and aid in process improvement.
What You Will Do
Operate Dual-Beam FIB to prepare TEM samples or conduct materials analysis (e.g., SIMS & XPS) and SEM imaging. Operate TEM for imaging, analysis, and reporting. Perform TEM sample preparation, including site marking, de-layering, applying protective coatings (spin coating and/or CVD tools), and other necessary pre-treatments.
Why It Might Be a Fit
The Failure Analysis Technician plays a key role in diagnosing issues and contributing to the continuous advancement of semiconductor technology. The role requires a strong sense of reliability and enthusiasm, and the ability to work independently and prioritize tasks to meet deadlines.
Requirements
- Associate's degree (A.A.S.) from a Science/Engineering/Technology program, or related field.
- Basic PC skills (MS Windows OS and MS Office).
- Ability to work independently and prioritize tasks to meet deadlines.
- Must be a team player with a positive attitude and strong work ethic.
- Ability to handle pressure in a fast-paced working environment.
Benefits
- Medical, Dental, and Vision Plans
- Income-Protection Programs
- 401(k) Retirement Savings Plan
- Paid Time-Off Programs and Holidays
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