Intern - Advanced Packaging TD

Micron Technology
Boise, ID
Category Data Analyst
Job Description
Micron Technology is seeking an Advanced Package TD Process Intern to collaborate on the development of next-generation interconnect technologies. This internship provides hands-on experience in line monitoring, data analysis, and project management, contributing to yield improvement and process optimization. The ideal candidate will have a strong understanding of analytical skills and experience with embedded systems.

Requirements

  • Currently enrolled in an accredited university with expected graduation no earlier than Fall 2026
  • Excellent data extraction, analysis, and reporting skills (e.g., system analytics, JMP)
  • Strong collaboration and communication skills across multi-functional teams
  • Ability to prioritize multiple complex tasks and adapt to changing responsibilities
  • Tenacity to work under timelines and limited resources

Benefits

  • Medical plans
  • Dental plans
  • Vision plans
  • Paid time off
  • Paid holidays
  • Benefit programs
  • Employee well-being
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