Role OverviewWe are seeking a Manufacturing Engineer to support the cleaving, bar stacking/unstacking and dicing operations within our semiconductor manufacturing facility. This role is responsible for maintaining production flow by troubleshooting equipment and process issues, performing routine calibration and maintenance of equipment, monitoring product quality, and driving continuous process improvements to improve yield, quality, and throughput.
What You Will Do
Troubleshoot production issues affecting cleaving, bar stacking/unstacking and dicing operations, resolve equipment and work order issues to minimize production downtime, support daily production activities to ensure smooth manufacturing flow, and perform daily calibration of cleaving and dicing equipment.
Why It Might Be a Fit
This role requires strong troubleshooting and root cause analysis skills, experience with semiconductor wafer processing, cleaving, dicing, or precision manufacturing, and knowledge of semiconductor manufacturing processes.
Requirements
- Master’s degree in Materials Engineering, Mechanical Engineering, Manufacturing Engineering, Electrical Engineering, or related discipline
- Experience with semiconductor wafer processing, cleaving, dicing, or precision manufacturing
- Experience maintaining automated manufacturing equipment
- Knowledge of semiconductor manufacturing processes
- Strong troubleshooting and root cause analysis skills
- Experience using Excel for data analysis
- Familiarity with LabVIEW is a plus
- Ability to work in a cleanroom environment
- Strong ability in communication
- Ability lift or move items weighing up to 20 pounds
Benefits
- Flexible and competitive health (medical, dental, vision) plans
- Employer matching on 401(k) deferrals
- Generous PTO policy, with unused PTO payout at end of the year
- Relocation package available within US
- Immigration sponsorships (Must be currently authorized to work in the US)
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