Principal Package Design Engineer

We are seeking a Principal Package Design Engineer to lead the development and integration of next-generation packaging solutions for high-performance semiconductors and electronic products. This role will focus on advanced package architecture, assembly processes, thermal and mechanical reliability, and cross-functional collaboration with design, applications, product engineering, manufacturing, suppliers, and quality teams.

What You Will Do

Lead Advanced Packaging Initiatives, define package architecture, drive package technology and OSAT selection and development, work closely with IC design, product definers, substrate, board, thermal, reliability, applications, and manufacturing teams to ensure package compatibility and performance.

Why It Might Be a Fit

The ideal candidate has deep expertise in semiconductor packaging technologies and a strong track record of bringing complex products from concept through qualification and high-volume production. A successful Principal Package Design Engineer will deliver robust package solutions that meet performance, reliability, and cost targets, enable smooth product transfer from concept to development to manufacturing, and reduce packaging risks through strong technical analysis and hands-on simulations.

Requirements

• MSc or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field.
• 5+ years of experience in advanced semiconductor packaging or advanced electronics packaging and system integration.
• Strong hands-on knowledge of advanced packaging technologies, materials, assembly processes, and application system integration as they apply to AI infrastructure and data center power management.
• Deep understanding of thermal, mechanical, and electrical interactions in package design and extensive, hands-on model setup, simulations, and analysis.
• Experience with package reliability testing and qualification standards.
• Experience working with OSATs, substrate vendors, assembly houses, and semiconductor supply chains.
• Proven ability to troubleshoot packaging failures, drive root cause/corrective action, and demonstrate strong project leadership and cross-functional communication skills.

Benefits

• Competitive benefits package
• Bonus opportunities
• Paid holidays
• Equity (amount not specified)
• Relocation assistance (not specified)