Role OverviewSkyworks is seeking a Principal Packaging Engineer to provide package-engineering leadership for new product introduction and support package design, material selection, assembly readiness, qualification, and production release.
What You Will Do
Provide package-design support and material-selection guidance to enable high-yielding, reliable, and cost-effective products, develop and introduce new packaging technologies, and lead end-to-end product readiness.
Why It Might Be a Fit
The successful candidate would be a technically credible packaging leader who can connect package architecture and assembly-process decisions to product performance, reliability, cost, capacity, and schedule.
Requirements
- Bachelor's degree in Mechanical Engineering or a related engineering discipline
- 10+ years of relevant semiconductor packaging experience
- Strong experience in new product introduction, package engineering, and package design for SOIC, QFN, lead-frame, LGA, BGA, and WLCSP semiconductor assemblies
Benefits
- Access to healthcare benefits (including a premium-free medical plan option)
- 401(k) plan and company match
- Employee stock purchase plan
- Paid time off (including vacation, sick/wellness, parental leave)
- Incentive plan
- Additional awards (including recognition and stock)
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