Role OverviewSkyworks is seeking a Principal Research Scientist to lead the development of next-generation wafer-level interconnects, wafer-level packaging (WLP) approaches, and heterogeneous integration technologies.
What You Will Do
The ideal candidate will drive the creation of transformational, differentiated integrated circuit and packaging technologies, author and influence technology roadmaps, and lead proposal development and execution of funded programs.
Why It Might Be a Fit
The candidate will work closely with internal product teams, external partners, government sponsors, and senior leadership to shape technology roadmaps and transition research concepts into manufacturable solutions.
Requirements
- Ph.D. in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field
- 8+ years of hands-on semiconductor R&D experience in cleanroom fabrication environments
- Demonstrated expertise in semiconductor BEOL processing and/or wafer-level packaging (WLP) technologies
- Hands-on experience with advanced metallization, dielectric integration, and interconnect process development
- Proven ability to lead and guide small, multidisciplinary R&D teams
- Strong written and verbal communication skills, including proposal development, technical reporting, and executive-level presentations
Benefits
- Access to healthcare benefits (including a premium-free medical plan option)
- A 401(k) plan and company match
- An employee stock purchase plan
- Paid time off (including vacation, sick/wellness, parental leave)
- Eligibility to participate in an incentive plan and certain roles are also eligible for additional awards, including recognition and stock
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