Role OverviewAs the leader of our Module Product Engineering function, you will own the end-to-end technical execution, workforce planning, and operational governance for advanced multi-chip power modules.
What You Will Do
Direct & Scale the Org: Own workforce planning, hiring, onboarding, skill development, and succession planning for a high-performing team of Product Engineers and Embedded PE Leads.
Why It Might Be a Fit
Drive High-Growth AI Tech: Lead the team building power delivery solutions for next-generation AI computing clusters.
Requirements
- 10+ years of semiconductor product engineering, manufacturing engineering, or test/quality leadership
- 5+ years managing technical engineering teams
- Proven technical expertise in semiconductor power products, advanced power modules, packaging/assembly processes, qualification, and high-volume manufacturing (HVM)
- Demonstrated track record of establishing operating metrics, yield governance, and execution standards across complex engineering workstreams
- Exceptional ability to lead cross-functional alignment across internal sites, OSAT partners, and executive stakeholders
- Clear, concise executive communication skills with the ability to summarize complex technical risks, trade-offs, and strategic recommendations
Benefits
- Competitive base salary
- Annual performance bonus
- RSU equity grants
- Top-tier health and retirement benefits
- Relocation assistance
- Flexible hybrid model
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