Role OverviewDesign printed circuit board electronics for next-generation electro-optical (EO), infrared (IR), and visible camera products. Collaborate with cross-functional teams to design, develop, integrate, and validate camera electronics from concept through production.
What You Will Do
Design multilayer PCBs for high-performance imaging systems and camera electronics, develop PCB layouts from schematics through manufacturing release, and perform high-speed signal integrity layout for various interfaces.
Why It Might Be a Fit
The ideal candidate has extensive experience designing complex multilayer PCBs with high-speed digital interfaces, precision analog circuitry, image sensors, FPGAs, power electronics, and EMI/EMC best practices.
Requirements
- B.S. or M.S. in Electrical Engineering, Computer Engineering, or related field
- 5+ years of camera PCB design experience
- Expert knowledge of PCB CAD tools such as Altium Designer, Cadence Allegro, or OrCAD PCB Designer
- Experience designing complex multilayer boards (8–20+ layers)
- Strong understanding of controlled-impedance routing, differential pairs, high-speed timing constraints, return-current paths, and crosstalk reduction
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