Silicon Photonics Flip-Chip Bonding Process Engineer

Apple
Cupertino, CA
Category Research
Job Description
Apple's Biophotonic team is seeking a Flip-Chip bonding process engineer to join their expanding silicon photonics group. This role focuses on day-to-day operations, documentation, and reporting for high-precision flip-chip bonding within a multidisciplinary team. The position demands strong analytical and communication skills and a deep understanding of process capabilities.

Requirements

  • BS degree in Optical Engineering, Electrical Engineering, Physics, or similar engineering field.
  • Background in semiconductor process integration, particularly in back-end manufacturing.
  • 3+ years of relevant industry experience.
  • Hands-on experience with die bonder tools and processes.
  • Strong problem solving ability and experience with material inspection.
  • Electrical and optical test experience.

Benefits

  • Comprehensive medical and dental coverage
  • Retirement benefits
  • Discounted products and free services
  • Tuition reimbursement
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